Design & Development Services
Microelectronic Packaging
We integrate diverse die technologies, that require a deep understanding of the interactions between device design, materials selection and process capability to enable reliable, high performance products.
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Service Category
Process Architecture
Multichip Modules & System in Package
Heterogeneous Integration
Product Qualification
Broadband Interconnect
Electro-Optical Integration
Custom Semiconductor Packaging
Talk with an Industry Expert
Product Lifecycle Services
We can support you from early concept design, through to end of life product manufacturing – we are versatile in how and when we engage with you during this cycle.
Industries Served
Customers benefit from advanced design, manufacturing services and new innovations leveraged from a range of industries and applied to their product.
Explore Related Services
Radio Frequency
Optical
Integrated Solutions
Process Development
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Our Mission
We Enable Products
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